Clik here to view.
Chip-Level Electromagnetic Crosstalk Signoff Using EMX Solver
Today’s wireless and high-speed chip designs integrate an incredible amount of functionality on very small silicon real estate. Such integration requires optimization from the early stages of the...
View ArticleClik here to view.
Accessing 24.1 Documentation
There's a whole host of changes being rolled out with Cadence OrCAD X and Allegro X Release 24.1 to make your design experience more intuitive, interactive, and seamless. In this post, we introduce the...
View ArticleClik here to view.
Managing Components in OrCAD X Capture Using Component Explorer
In OrCAD X Capture, the Component Explorer interface provides a user-friendly way to add parts to your designs. With this intuitive feature, you can effortlessly explore an extensive selection of...
View ArticleClik here to view.
Training Webinar: Voltage Ripple Analysis with Sigrity X SystemPI
Voltage Ripple Analysis with Sigrity X SystemPI(read more)
View ArticleClik here to view.
BoardSurfers: Detect Missing Padstacks Masks Using Allegro X PCB DesignTrue DFM
A common Design for Manufacturing (DFM) mistake that could lead to rework when designing a PCB is the oversight of padstack masks. When defining libraries, it is essential to specify soldermask and...
View ArticleClik here to view.
Participating in Cadence Community Forums
Do you observe quietly or participate in online community discussions? If it’s the former, you can still learn a great deal from other experts in this way, but engaging by giving answers, asking...
View ArticleClik here to view.
Johanson Technology Adds Clarity Encryption Support to New Antenna Models
Johanson Technology has collaborated with Cadence to provide customers with encrypted antenna models for Cadence's Clarity 3D Solver electromagnetic analysis solution. Johanson provides antenna models...
View ArticleClik here to view.
Crafting Stellar Performance in the Rapidly Evolving Arm SoC Landscape
In an era where technology evolves at lightning speed, ensuring top-tier system performance in Arm system-on-chip (SoC) architectures is both a challenge and a necessity. The race is on for developers...
View ArticleClik here to view.
System Analysis Knowledge Bytes: Thermal Effects on Voltage Margins with...
Capture the effects of temperature on electrical design margins with the new course: DC and Thermal Analysis with Celsius PowerDC(read more)
View ArticleClik here to view.
Training Insights: Ascent: Schematic Design Variants in Allegro X System Capture
Most electronic products have variations, such as a different RAM size or different supply voltages, because of various geographic locations. Variants, which are modifications of the base design, offer...
View ArticleClik here to view.
BoardSurfers: How Many Test Points are Enough for Effective In-Circuit Testing?
Many PCB engineers have nightmares about retrofitting test point pads into their perfectly arranged designs following a final review with senior experts. When I started my journey in PCB design many...
View ArticleClik here to view.
Machine Learning Is Revolutionizing IBIS-AMI Optimization in High-Speed Design
The complexity of IBIS-AMI models used in simulating serial links has increased to keep pace with serial link speeds. In the past, an exhaustive search method was used to find the best set of...
View ArticleClik here to view.
Free Signal Integrity
What do we mean by free signal integrity? Be sure to attend our joint Wild River Technology/Cadence DesignCon 2025 technical session, where we will unveil how understanding anisotropic materials and...
View ArticleClik here to view.
Designing High-Performance Sensor Packages to Ensure Optimized Performance
In an era where technology and connectivity reign supreme, electronic, and mechanical design fusion is revolutionizing the user experience. Gone are the days when components could be developed in...
View ArticleClik here to view.
Join Cadence at DesignCon 2025 – Accelerate System Design with Cadence.AI
Are you ready to simplify your workflows, tackle your design challenges with confidence, and push your projects to new heights? DesignCon 2025 is right around the corner. Join us on January 28-30 in...
View ArticleClik here to view.
Exploring Themes in OrCAD X Capture
The dark theme turns many user interface elements of your application dark and reduces the amount of light emitted from screens. Given that we spend about one-third of our day in front of laptop...
View ArticleClik here to view.
The Year That Was: PCB and Package Design Training, Blogs, and Videos in 2024
Happy New Year! As another year has started, it’s time to reflect on our top blogs, training sessions, and training highlights from the last year and recap the significant news that emerged. Over the...
View ArticleClik here to view.
Engage, Learn, and Connect: Quiz Power in the Cadence Community Forum
Find out how much you know with the fun, interactive quizzes created by our expert application engineers! The Community Forum quizzes are an entertaining way to strengthen your knowledge, meet other...
View ArticleClik here to view.
DesignCon 2025 Highlights and Papers on Demand
The Cadence MSA team had a GREAT DesignCon highlighting how Cadence can help you accelerate your PCB and advanced IC packaging design cycles with electromagnetic, electronic, and thermal system...
View ArticleClik here to view.
Setting the Stage: The Power of a Well-Crafted Introduction in Community Forums
You never get a second chance to make a first impression. Your introduction conveys a lot of information to your readers. An introduction is meant to draw the reader into your perspective, spark their...
View Article